Bambu Lab supports for PLA/PETG
Product features
- Easy removal without tools
- Smooth support interface
- Recommended for all PLA and PETG
- Transparent appearance
- Supplied with a reusable high-temperature-resistant spool
- Diameter: 1.75 mm +/- 0.05 mm
Usage notes
- Use only for printing the support interface
- Avoid printing standalone models
- Compatible with AMS and AMS lite
Product details
- Brand:
- Bambu Lab
- Category:
- Filament
Product description
Bambu Support for PLA/PETG
The best support material, compatible with both PLA and PETG filaments. Easy removal without tools that preserves the intact surface of the printed object.
Support for PLA/PETG Filament
- Easy removal without tools
The PLA/PETG support material is specially designed to minimize fusion with PLA and PETG due to differences in polarity. This unique property ensures easy removal of the support interface, reducing the risk of damaging the printed object.
Smooth support interface
PLA/PETG Support offers consistently smooth surface quality at the contact area, ensuring optimal support for fine details. With zero upper interface gap and Z-distance, our support material provides precision and reliability, allowing you to easily print even the most intricate designs.
Cross-compatibility
PLA/PETG Support is designed for seamless use with both PLA and PETG, eliminating the need to change support materials. This saves time and simplifies your workflow.
Parameter comparison
See more information about filament comparisons in the Bambu Filament Guide >>
| Support for PLA/PETG | Support for PLA | Support for ABS | Support for PA/PET | PVA | |
|---|---|---|---|---|---|
| Color | Natural | White & Black | White | Green | Transparent |
| Nozzle type | All sizes / materials | All sizes / materials | 0.4 / 0.6 / 0.8 mm | 0.4 / 0.6 / 0.8 mm hardened steel | All sizes / materials |
| Nozzle temperature | 190 - 220 °C | 220 - 230 °C | 240 - 270 °C | 280 - 300 °C | 220 - 250 °C |
| Bed temperature | 35 - 60 °C | 35 - 45 °C | 80 - 100 °C | 80 - 100 °C | 35 - 45 °C |
| Print speed | < 100 mm/s | < 200 mm/s | < 100 mm/s | < 100 mm/s | < 200 mm/s |
| Solubility | Insoluble in water | Insoluble in water | Insoluble in water, soluble in limonene | Insoluble in water | Water-soluble |
| Drying before use | Optional | Optional | Optional | Required | Required |
| Moisture protection during use | Optional | Optional | Optional | Required | Required |
| Filament compatibility | PLA, PETG | PLA | ABS | PAHT-CF, PA6-CF, PA6-GF, PET-CF | PLA, PETG |
Accessory compatibility
Recommended: Cool Plate, High Temperature Plate, Textured PEI Plate or Engineering Plate
Not recommended: /
Nozzle: All sizes / materials
Bambu Liquid Glue / Glue Stick: Bambu Liquid Glue / Glue Stick
RFID for smart printing
All printing parameters are stored in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No tedious setup.
Recommended print settings
- Drying settings (oven): 75 °C, 8 h
- Container humidity: < 20% RH (sealed with desiccant)
- Nozzle temperature: 190 - 220 °C
- Bed temperature (with glue): 35 - 60 °C
- Print speed: < 100 mm/s
Physical properties
- Density: 1.28 g/cm³
- Vicat softening temperature: N/A
- Heat deflection temperature: N/A
- Melting temperature: 185 °C
- Melt flow index: 14.3 ± 1.2 g/10 min
Mechanical properties
- Tensile strength: N/A
- Elongation at break: N/A
- Flexural modulus: N/A
- Flexural strength: N/A
- Impact strength: N/A
